Range of Thermal Conductivities

Thermal conductivities of epoxy adhesives can be grouped into five general segments:

  • 1. Very high: >4.0 W/(m K) (new technologies)
  • 2. High: >2.0 W/(m K) (typically filled with silver)
  • 3. Ordinary: 0.7-2.0 W/(m K) (aluminum and boron nitride filled)
  • 4. Low: <0.7 W/(m K) (no functional additives mentioned)
  • 5. Epoxy resin: 0.2-0.35 W/(mK)

A comparison of different thermal conductive adhesives is given in Table 7.


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